首页 | 本学科首页   官方微博 | 高级检索  
     检索      


TEM and HRTEM Study of Microstructures in Omphacite from UHP Eclogites at Shima, Dabie Mountains, China
Authors:WU Xiuling  HAN Yujing  MENG Dawei  YANG Weiran and LI DouxingTest Center and Faculty of Earth Sciences  China University of Geosciences  Wuhan  HubeiLaboratory of Atomic Imaging of Solids
Institution:WU Xiuling,HAN Yujing,MENG Dawei,YANG Weiran and LI DouxingTest Center and Faculty of Earth Sciences,China University of Geosciences,Wuhan,HubeiLaboratory of Atomic Imaging of Solids,Institute of Metal Research,Chinese Academy of Sciences,Shenyang,Liaoning
Abstract:Transmission electron microscope (TEM) and high resolution transmission electron microscope (HRTEM) analyses have been performed on omphacite from ultra-high pressure (UHP) eclogites at the locality of Shima, Dabie Mountains, China. TEM reveals that the microstructures consist dominantly of dislocation substructures, including free dislocations, loops, tiltwalls, dislocation tangles and subboundaries. They were produced by high-temperature ductile deformation, of which the main mechanism was dislocation creep. Antiphase domain (APD) boundaries are common planar defects; an age of 470±6 Ma for UHP eclogite formation has been obtained from the equiaxial size of APDs in ordered omphacites from Shima, coincident with ages given by single-zircon U-Pb dating (471±2 Ma). HRTEM reveals C2/c and P2/n space groups in different parts of one single omphacite crystal, and no exsolution is observed in the studied samples, which is attributed to rapid cooling. It is suggested that the UHP eclogites underwent a long period of annealing at high temperatures, followed by relatively rapid cooling. These data provide valuable information for the formation and exhumation mechanism of UHP eclogites in the Dabie high-pressure (HP) and UHP metamorphic belt.
Keywords:UHP eclogite  omphacite  TEM and HRTEM  Dabie Mountains
本文献已被 CNKI 等数据库收录!
点击此处可从《Acta Geologica Sinica》浏览原始摘要信息
点击此处可从《Acta Geologica Sinica》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号