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A seismic retrofit method by connecting viscous dampers for microelectronics factories
Authors:Jenn‐Shin Hwang  Shiang‐Jung Wang  Yin‐Nan Huang  Jay‐Fu Chen
Institution:1. Department of Construction Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan;2. National Center for Research on Earthquake Engineering, Taipei, Taiwan;3. Department of Civil Engineering, National Taiwan University, Taipei, Taiwan;4. Department of Civil, Structural and Environmental Engineering, State University of New York at Buffalo, Buffalo, NY, U.S.A.
Abstract:The implementation of viscous dampers to microelectronics factories has been previously proved not to affect the micro‐vibration of the factories in operation so that the vibration‐sensitive manufacturing process will not be interfered. Therefore, a seismic retrofit strategy which employs the viscous dampers installed in between the exterior and interior structures of the ‘fab’ structure is proposed in the study. The design formulas corresponding to the proposed retrofit method are derived using the non‐proportional damping theory. Based on the study, it is found that the added damping ratio to the fab structure depends greatly on the frequency ratio of the two structures in addition to the damping coefficients of the added dampers. Outside the bandwidth of the frequency ratio in which the added damping ratio is very sensitive to the variation of the frequency ratio, the added damping ratio can be well captured using the classical damping theory. Copyright © 2007 John Wiley & Sons, Ltd.
Keywords:seismic retrofit  viscous damper  microelectronics factory  seismic design
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