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Preparation and study on performance of submicron nickel powder for multilayer chip positive temperature coefficient resistance
Authors:Chen Yong  Gong Shu-Ping  Fu Qiu-Yun  Zheng Zhi-Ping  Huang Ri-Ming and Su Peng
Institution:Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan 430074, China;Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan 430074, China;Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan 430074, China;Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan 430074, China;Department of Electronic Science & Technology, Huazhong University of Science & Technology, Wuhan 430074, China;School of Physics and Electronic Technology and Key Laboratory of Ferroelectric and Piezoelectric Materials and Devices of Hubei Province, Hubei University, Wuhan 430062, China
Abstract:
Keywords:submicron  nickel powder  liquid-reduction process  positive temperature coefficient (PTC)
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