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X射线三维CT技术在元器件失效分析中的应用
引用本文:路浩天,卢晓青,张祥春,蔡良续,吴琼,张辉.X射线三维CT技术在元器件失效分析中的应用[J].CT理论与应用研究,2012,21(3):433-441.
作者姓名:路浩天  卢晓青  张祥春  蔡良续  吴琼  张辉
作者单位:1. 中国航空综合技术研究所,北京,100028
2. 北京三星通信技术研究有限公司,北京,100028
3. 辽河油田锦州采油厂,辽宁锦州,121209
基金项目:航空科学基金项目(20090241005)
摘    要:通过比较X射线DR,普通断层CT技术,扫描声学显微镜的功能特点,分析了X射线三维CT技术的优势。通过对焊接空洞、微动开关失效案例以及不同封装形式器件的分析,研究了X射线三维CT技术在电子元器件失效分析领域的应用。同时根据X射线三维CT成像的特点,分析了该技术发展的前景。

关 键 词:X射线三维CT  失效分析  电子元器件

Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis
LU Hao-tian,LU Xiao-qing,ZHANG Xiang-chun,CAI Liang-xu,WU Qiong,ZHANG Hui.Application of X-ray 3D CT Technology on Electrocomponent Failure Analysis[J].Computerized Tomography Theory and Applications,2012,21(3):433-441.
Authors:LU Hao-tian  LU Xiao-qing  ZHANG Xiang-chun  CAI Liang-xu  WU Qiong  ZHANG Hui
Institution:1 .AVIC Aero-Polytechnology Establishment, Beijing 100028, China 2.Beijing Samsung Telecom Technology Co., Ltd, Beijing 100028, China 3.Liaohe oilfield company Jinzhou oil produotion plant, Jinzhou 121209, China
Abstract:Through comparing the functional characteristics of X-ray, traditional CT and SAM, the advantage of X-ray 3D CT technology was analyzed. With the analysis of solder voids, micro switch and different package components, research on the application of 3D CT technology in electronic component failure analysis was conducted. In addition, according to the feature of X-ray 3D CT imaging, the prospect of this technology was discussed.
Keywords:X-ray 3D CT  failure analysis  electrocomponent
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